Last Updated
:2025/12/03
die bonder
Noun
Japanese Meaning
基板上に電子チップ(半導体など)を取り付け、他のデバイスと接続するための装置。 / チップ実装機、半導体ダイを基板に接続するための生産装置。
( plural )
Quizzes for review
A machine that installs chips (electronic devices) onto a substrate and connects them to other devices
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die bonder
The new die bonder reduced manufacturing defects by precisely placing each chip on the substrate.
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The new die bonder reduced manufacturing defects by precisely placing each chip on the substrate.
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