Last Updated :2025/12/03

die bonder

Noun
Japanese Meaning
基板上に電子チップ(半導体など)を取り付け、他のデバイスと接続するための装置。 / チップ実装機、半導体ダイを基板に接続するための生産装置。
What is this buttons?

新しいダイボンディング装置は、チップを基板に正確に配置することで製造不良を減らした。

plural

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A machine that installs chips (electronic devices) onto a substrate and connects them to other devices

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die bonder

The new die bonder reduced manufacturing defects by precisely placing each chip on the substrate.

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The new die bonder reduced manufacturing defects by precisely placing each chip on the substrate.

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