Last Updated:2025/12/04

When designing high-density PCBs, capacitive couplings between traces can cause crosstalk and degrade signal integrity.

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When designing high-density PCBs, capacitive couplings between traces can cause crosstalk and degrade signal integrity.

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高密度のプリント基板を設計する際、トレース間の容量結合がクロストークを引き起こし、信号の整合性を低下させる可能性があります。

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