Last Updated:2025/12/03

Field's metal melts at a much lower temperature than solder, making it ideal for low-temperature bonding in delicate electronic repairs.

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Field's metal melts at a much lower temperature than solder, making it ideal for low-temperature bonding in delicate electronic repairs.

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ビスマス、インジウム、スズからなる共晶の低融点合金は、はんだよりもはるかに低い温度で溶けるため、繊細な電子機器の低温接合に最適です。

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