Last Updated:2025/11/23

The soldering process relied on a eutectic alloy to ensure a clean, low-temperature joint between the circuit board components.

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The soldering process relied on a eutectic alloy to ensure a clean, low-temperature joint between the circuit board components.

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はんだ付け作業では、回路基板の部品間に清潔で低温の接合を確保するために共晶合金が用いられた。

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