Last Updated:2025/11/21

Researchers measured the Kapitza resistance at the interface between the copper substrate and liquid helium to quantify the resulting temperature discontinuity.

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Researchers measured the Kapitza resistance at the interface between the copper substrate and liquid helium to quantify the resulting temperature discontinuity.

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研究者たちは、銅基板と液体ヘリウムの界面における熱流に対する界面熱抵抗(液体ヘリウムと固体の界面で温度の不連続を生じさせるもの)を測定して、その温度不連続を定量化した。

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